On May 19, 2023, the Information Technology Institute – Vietnam National University, Hanoi received and worked with the delegation from Toshiba Corporation on collaboration in training and research in the field of chip design. Representing the Information Technology Institute were A/Professor Dr. Tran Xuan Tu – Director of the Institute, Dr. Bui Duy Hieu – Head of the AIoT Laboratory, and the research staff from the Smart Integrated Systems research group. The Toshiba Corporation delegation was represented by Mr. Takashi Takebayashi – Head of the LSI Department, Mr. Daisuke Osada – Chief Expert, along with the research staff from Toshiba Corporation in Vietnam.
During the working session, both parties reviewed and evaluated the achievements made during the previous collaboration in various aspects, from research activities to training in chip design. Many graduates from Vietnam National University, Hanoi have become key engineers for Toshiba, currently working for the corporation both in Japan and Vietnam. The representatives of Toshiba Corporation highly appreciated the efforts of the research team at the Information Technology Institute in implementing research projects and integrating research with high-quality student training. Based on the results of the previous collaboration phase, both parties discussed and reached an agreement on the research cooperation theme for the next three years (2023-2026) – combining multi-core chip design and artificial intelligence. Accordingly, both parties will further enhance their cooperative activities, both in terms of depth and diversification of collaboration forms. Particularly, in the coming period, both parties will establish a co-lab model to share resources and support each other in research and development (R&D) activities, as well as direct the practical applications of research products. As part of the working session, the Toshiba Corporation delegation also visited research activities at the research units and laboratories of the Information Technology Institute, as well as some exemplary products in chip design and applications.
